EST450-4T 18″ Silicon Ingot Cropping and Seeding Single Endless Wire Saw
Silicon Ingot Cropping Seeding Single Wire Saw
Breif Introduction :
ESV450-4T is designed to be a Silicon Ingot Cropping Seeding Single Wire Saw,The loading table is soft material which is suitable for brittle material.It’s especially convenient for Silicon ingot cropping.This machine uses diamond wire loop as cutting tool,high linear speed and small wire diameter ensures better cutting surface and less kerf loss.
The cutting speed of this machine is parabolic type,material breakage and wire marks can be highly reduced.
Usage of this endless diamond wire saw:
18 inch Silicon ingot and smaller
Parameter of EST450-4T:
1 Machine Dimension: L2000 mm*W1200 mm*H1800 mm
2 Motor speed：2800 RMP
3 Total Weight：1500 KG
4 loading capacity: 800 KG
5 Max linear speed: 38 m/s
6 Less than 3.5 KW
7 Cutting wire:Diamond wire loop /endless diamond wire
8 Wire NO.: 1 PC
9 Wire diameter: 0.42 MM
Material dimension : smaller than φ450*1500 mm
This model was supplied to semicone companies to do silicon ingot cropping ,but most of semiconductor companies are not able to process 18 inch ingot,this is almost a customized model.it can do cutting off and seeding.
The view of this Silicon Ingot Cropping Seeding Single Wire Saw
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