ESV300-2T 8″ Silicon Cut Single Diamond Wire Saw
Silicon Cut Single Diamond Wire Saw
Breif Introduction :
This diamond wire saw machine is made to do silicon cut off/cropping, it uses diamond wire loop/endless diamond wire as cutting blade,the cut kerf is 0.45mm, far more small than diamond band saw.
And there has less possibility of silicon edge break which decreases defective product rate.
The machine cut vertically, and it’s clamping device is made for silicon ingot, the moving roller and air pressure clamp protects silicon to be not damaged.
Usage of this endless diamond wire saw:
Cut Silicon ingot smaller than 8 inch.
Cut off and seeding
Rod shape material cut
Parameter of ESV300-4T:
1 Machine Dimension: L2443.8mm*W1354mm*H1861.5mm
2 Total Weight：1500 KG
3 loading capacity:800 KG
4 Max linear speed:38 m/s
5 Less than 3.5 KW
6 Cutting wire:Diamond wire loop /endless diamond wire
7 Wire NO.: 1 PC
8 Wire diameter: 0.42 MM
Material dimension : smaller than L1300mm*W280mm*H280mm
General Views of ESV300-4T endless wire saw
This model was supplied to a lot semicome companies to do silicon ingot cropping ,all ingot size smaller than diameter 280 MM can b cut by this silicon cut single diamond wire saw.
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